77 Publications (Page 1 of 4)
2022
Additive manufacturing and characterization of microstructures using two-photon polymerization for use in cryogenic applications
Peek, Sherman E⋅Peek, Sherman E⋅Ward, Jacob⋅Ward, Jacob⋅Bankson, Stephen⋅Bankson, Stephen⋅⋅⋅Sellers, John A⋅Sellers, John A⋅Adams, Mark L⋅Adams, Mark L⋅Hamilton, Michael C and Hamilton, Michael C
Journal of Materials Research, vol. 37, (no. 12), pp. 1978-1985, 2022. | Journal Article
 
Approaches for High Performance and Thermally Optimized Flexible Cryogenic Microwave Ribbon Cables
Peek, Sherman E⋅Shah, Archit⋅Yelamanchili, Bhargav⋅Gupta, Vaibhav⋅Sellers, John A⋅Tuckerman, David B and Hamilton, Michael C
IOP Conference Series. Materials Science and Engineering, vol. 1241, (no. 1), May 2022. | Journal Article
 
Microwave Characterization of Gamma Ray Irradiated Thin Film Embedded and Non-embedded Nb Resonators
Yelamanchili, Bhargav⋅Gupta, Vaibhav⋅Zou, Simin⋅Christiansen, Robert⋅Cichon, Max C⋅Sellers, John A⋅Park, Minseo⋅Mahjouri-Samani, Masoud⋅Tuckerman, David B and Hamilton, Michael C
IOP Conference Series. Materials Science and Engineering, vol. 1241, (no. 1), May 2022. | Journal Article
2020
Monolayer 2D quantum materials subjected to gamma irradiation in high-vacuum for nuclear and space applications
Elafandi, Salah⋅Christiansen, Robert⋅Christiansen, Robert⋅⋅Azam, Nurul⋅Cichon, Max⋅Cichon, Max⋅Park, Minseo⋅Park, Minseo⋅Hamilton, Michael C.⋅Hamilton, Michael C⋅Mahjouri-Samani, Masoud and
Applied Physics Letters, vol. 116, (no. 21), May 26, 2020. | Journal Article
2019
Complementary Quantum Logic Family Using Josephson Junctions and Quantum Phase-Slip Junctions
Goteti, Uday Sravan and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 29, (no. 5), pp. 6, 2019-Aug.. | Journal Article
 
Distinguishing Dielectric Loss From Superconductor Loss Using Flexible Thin-Film Superconducting Resonator Structures
Gupta, Vaibhav⋅Yelamanchili, Bhargav⋅Zou, Simin⋅Isaacs-Smith, Tamara⋅Sellers, John A⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 29, (no. 5), pp. 5, 2019-Aug.. | Journal Article
 
Low-loss cable-to-cable parallel connection method for thin-film superconducting flexible microwave transmission lines
Zou, Simin⋅Yelamanchili, Bhargav⋅Gupta, Vaibhav⋅Sellers, John A⋅Isaacs-smith, Tamara⋅Tuckerman, David B and Hamilton, Michael C
Superconductor Science and Technology, vol. 32, (no. 7), pp. 75006, 2019-07-01. | Journal Article
 
On the anomaly in the electrical characteristics of thin film transistors with multi-layered sol-gel processed ZnO
Mirkhani, Vahid⋅Mirkhani, Vahid⋅Mirkhani, Vahid⋅Yapabandara, Kosala⋅Yapabandara, Kosala⋅Yapabandara, Kosala⋅Wang, Shiqiang⋅Wang, Shiqiang⋅Wang, Shiqiang⋅Khanal, Min Prasad⋅Khanal, Min Prasad⋅Khanal, Min Prasad⋅Uprety, Sunil⋅Uprety, Sunil⋅Uprety, Sunil⋅Sultan, Muhammad Shehzad⋅Sultan, Muhammad Shehzad⋅Sultan, Muhammad Shehzad⋅Ozden, Burcu⋅Ozden, Burcu⋅Ozden, Burcu⋅Ahyi, Ayayi Claude⋅Ahyi, Ayayi Claude⋅Ahyi, Ayayi Claude⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Sk, Mobbassar Hassan⋅Sk, Mobbassar Hassan⋅Sk, Mobbassar Hassan⋅Park, Minseo⋅Park, Minseo and Park, Minseo
Thin Solid Films, vol. 672, pp. 156, 2019-02-28. | Journal Article
 
Reliability Studies of Nb/AlOx/Al/Nb Josephson Junctions Through Accelerated-Life Electrical Stress Testing
Goteti, Uday S⋅Denton, Matthew⋅Krause, Keith⋅Stephen, Andrew⋅Sellers, John A⋅Sullivan, Steffen⋅Hamilton, Michael C⋅Wynn, Alex and Tolpygo, Sergey K
IEEE Transactions on Applied Superconductivity, vol. 29, (no. 5), pp. 7, 2019-Aug.. | Journal Article
 
Superconducting Neuromorphic Computing Using Quantum Phase-Slip Junctions
Cheng, Ran⋅Goteti, Uday S and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 29, (no. 5), pp. 5, 2019-Aug.. | Journal Article
 
Thin-Film Nb/Polyimide Superconducting Stripline Flexible Cables
Gupta, Vaibhav⋅Yelamanchili, Bhargav⋅Zou, Simin⋅Isaacs-Smith, Tamara⋅Sellers, John A⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 29, (no. 5), pp. 5, 2019-Aug.. | Journal Article
2018
Charge-Based Superconducting Digital Logic Family Using Quantum Phase-Slip Junctions
Goteti, Uday S and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 28, (no. 4), pp. 4, 2018-June. | Journal Article
 
Conductive Mechanism of Bi-Doped Thick-Film Dielectric in High-Temperature Aging With Bias
Zhou, Zhangming⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, (no. 5), pp. 791, 2018-May. | Journal Article
 
Evaluation of Thick-Film Materials for High-Temperature Packaging
Zhou, Zhangming⋅Cui, Jinzi⋅Yu, Fang⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, (no. 5), pp. 783, 2018-May. | Journal Article
 
Mechanical Reliability of Thick Films for High-Temperature Packaging
Zhou, Zhangming⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, (no. 6), pp. 1013, 2018-June. | Journal Article
 
Proton-induced displacement damage in ZnO thin film transistors: Impact of damage location
Yapabandara, Kosala⋅Yapabandara, Kosala⋅Mirkhani, Vahid⋅Mirkhani, Vahid⋅Wang, Shiqiang⋅Wang, Shiqiang⋅Khanal, Min P⋅Khanal, Min P⋅Uprety, Sunil⋅Uprety, Sunil⋅Isaacs-Smith, Tamara⋅Isaacs-Smith, Tamara⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Park, Minseo and Park, Minseo
Microelectronics Reliability, vol. 91, pp. 268, December 2018. | Journal Article
 
Spiking neuron circuits using superconducting quantum phase-slip junctions
Cheng, Ran⋅Goteti, Uday S and Hamilton, Michael C
Journal of Applied Physics, vol. 124, (no. 15), pp. 152126, 20181021. | Journal Article
 
Superconducting Neuromorphic Computing Using Quantum Phase-Slip Junctions
Cheng, Ran⋅Goteti, Uday S and Hamilton, Michael C
2018-12-13. | Journal Article
2017
Embedded Niobium Using PI-2611 for Superconducting Flexible Cables
Zou, Simin⋅Cao, Yang⋅Hernandez, George A⋅Bai, Rujun⋅Gupta, Vaibhav⋅Sellers, John A⋅Ellis, Charles D⋅Tuckerman, David B and Hamilton, Michael C
MRS Advances, vol. 2, (no. 41), pp. 2204, 2017-00-00. | Journal Article
 
High-Quality Factor Superconducting Flexible Resonators Embedded in Thin-Film Polyimide HD-4110
Zou, Simin⋅Cao, Yang⋅Gupta, Vaibhav⋅Yelamanchili, Bhargav⋅Sellers, John A⋅Ellis, Charles D⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 27, (no. 7), pp. 5, 2017-Oct.. | Journal Article
 
Influence of Fatigue and Bending Strain on Critical Currents of Niobium Superconducting Flexible Cables Containing Ti and Cu Interfacial Layers
Zou, Simin⋅Bai, Rujun⋅Hernandez, George A⋅Gupta, Vaibhav⋅Cao, Yang⋅Sellers, John A⋅Ellis, Charles D⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 27, (no. 4), pp. 5, 2017-June. | Journal Article
 
Microwave Loss Measurements of Copper-Clad Superconducting Niobium Microstrip Resonators on Flexible Polyimide Substrates
Bai, Rujun⋅Hernandez, George A⋅Cao, Yang⋅Sellers, John A⋅Ellis, Charles D⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 27, (no. 4), pp. 7, 2017-June. | Journal Article
 
Microwave Performance of Niobium/Kapton Superconducting Flexible Cables
Hernandez, George A⋅Bai, Rujun⋅Cao, Yang⋅Sellers, John A⋅Ellis, Charles D⋅Tuckerman, David B and Hamilton, Michael C
IEEE Transactions on Applied Superconductivity, vol. 27, (no. 4), pp. 4, 2017-June. | Journal Article
 
Minimizing Film Stress and Degradation in Thin-Film Niobium Superconducting Cables
Gupta, Vaibhav⋅Sellers, John A⋅Ellis, Charles D⋅Yelamanchili, Bhargav⋅Zou, Simin⋅Cao, Yang⋅Tuckerman, David B and Hamilton, Michael C
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2017, (no. DPC), pp. 25, 2017-01-00. | Journal Article
 
Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300 °C Applications
Yu, Fang⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, (no. 6), pp. 861, 2017-June. | Journal Article