77 Publications (Page 3 of 4)
2014
Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°CAkkara, Francy J⋅Akkara, Francy J⋅Goteti, Uday S⋅Goteti, Uday S⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Palmer, Michael J⋅Palmer, Michael J⋅Suhling, Jeffrey C and Suhling, Jeffrey CInternational Symposium on Microelectronics, vol. 2014, (no. 1), pp. 504, 2014-01-00.
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Design Considerations and Ring-down Characteristics of Micromachined, High Current Density CapacitorsBeal, Aubrey N⋅Tatarchuk, John⋅Stevens, Colin⋅Baginski, Thomas⋅Hamilton, Michael and Dean, Robert NAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2014, (no. DPC), pp. 1406, 2014-01-00.
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Efficient Determination of Copper Electroplating Chemistry AdditivesEllis, Charles D⋅Hamilton, Michael C⋅Nakamura, James R and Wilamowski, Bogdan MIEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, (no. 8), pp. 1390, 2014-Aug..
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Fabrication and Characterization of Double Helix Structures for Compliant and Reworkable Electrical InterconnectsXu, Pingye⋅Pfeiffenberger, Alexander H⋅Ellis, Charles D and Hamilton, Michael CJournal of Microelectromechanical Systems, vol. 23, (no. 5), pp. 1227, 2014-Oct..
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High Channel Mobility 4H-SiC MOSFETs by Antimony Counter-DopingModic, Aaron⋅Modic, Aaron⋅Modic, Aaron⋅Liu, Gang⋅Liu, Gang⋅Liu, Gang⋅Ahyi, Ayayi C⋅Ahyi, Ayayi C⋅Ahyi, Ayayi C⋅Zhou, Yuming⋅Zhou, Yuming⋅Zhou, Yuming⋅Xu, Pingye⋅Xu, Pingye⋅Xu, Pingye⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Williams, John R⋅Williams, John R⋅Williams, John R⋅Feldman, Leonard C⋅Feldman, Leonard C⋅Feldman, Leonard C⋅Dhar, Sarit⋅Dhar, Sarit and Dhar, SaritIEEE Electron Device Letters, vol. 35, (no. 9), pp. 896, 2014-Sept..
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Ink-Jet Printed Cu/CuxO/Ag ReRAM Memory Devices Fabricated on Flexible SubstrateZou, Simin and Hamilton, Michael CMRS Proceedings, vol. 1692, 2014-00-00.
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Pressureless, Low Temperature Sintering of Micro-scale Silver Paste for Die Attach for 300°C ApplicationsYu, Fang⋅Johnson, R. Wayne and Hamilton, MichaelAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2014, (no. HITEC), pp. 171, 2014-01-00.
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Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip InterconnectsXu, Pingye⋅Xu, P.⋅Xu, Pingye⋅Tong, Fei⋅Tong, Fei⋅Tong, F.⋅Davis, Virginia A⋅Davis, Virginia A⋅Davis, V.A.⋅Park, Minseo⋅Park, M.⋅Park, Minseo⋅Hamilton, Michael C⋅Hamilton, Michael C and Hamilton, M.C.IEEE Transactions on Nanotechnology, vol. 13, (no. 6), pp. 1126, 2014-Nov..
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2013
A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic TechnologyGlover, Michael D⋅Hamilton, Michael C⋅Decrossas, Emmanuel⋅Porter, Kaoru⋅Pfeiffenberger, Alexander and Mantooth, H. AlanInternational Symposium on Microelectronics, vol. 2013, (no. 1), pp. 688, 2013-01-00.
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Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing TechniquesBailey, J. Phillip⋅Glover, Michael D⋅Decrossas, Emmanuel⋅Porter, Kaoru⋅Cannon, Tom⋅Mantooth, H. Alan and Hamilton, Michael CAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2013, (no. CICMT), pp. 53, 2013-09-00.
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Indium plated carbon nanotubes pattern on flexible substrate defined by ink-jet printingXu, Pingye and Hamilton, Michael CMRS Proceedings, vol. 1505, 2013-00-00.
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Nanostructured Amorphous Silicon on Metal Electrodes: Electrical and Optical PropertiesHernandez, George A⋅Martinez, Daniel⋅Patenaude, Stephen and Hamilton, Michael CMRS Proceedings, vol. 1551, pp. 66, 2013-00-00.
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Nonlinear Transmission Lines Using Substrate Integrated Waveguides in LTCCCaudle, Byron⋅Baginski, Michael and Hamilton, MichaelAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2013, (no. CICMT), pp. 68, 2013-09-00.
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Through Si Vias Using Liquid Metal Conductors for Re-workable 3D ElectronicsHernandez, George A⋅Martinez, Daniel⋅Patenaude, Stephen⋅Ellis, Charles⋅Palmer, Michael and Hamilton, MichaelAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2013, (no. DPC), pp. 1357, 2013-01-00.
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2012
In-Coated Carbon Nanotubes for Flexible InterconnectsXu, Pingye and Hamilton, Michael CAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2012, (no. DPC), pp. 985, 2012-01-00.
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Thin-Film Signal and Power Redistribution Layers Based on AL-X and CuBailey, John⋅Pfeiffenberger, Alexander⋅Ellis, Charles⋅Palmer, Mike⋅Issac-Smith, Tamara and Hamilton, MichaelInternational Symposium on Microelectronics, vol. 2012, (no. 1), pp. 333, 2012-01-00.
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2005
Polyfluorene-based organic field-effect transistors (Dissertation)Hamilton, Michael (2005).
2004
Field-Effect Mobility of Organic Polymer Thin-Film TransistorsHamilton, Michael C⋅Martin, Sandrine and Kanicki, JerzyChemistry of Materials, vol. 16, (no. 23), pp. 4704, 20041116.
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Organic polymer thin-film transistor photosensorsHamilton, Michael and Kanicki, JerzyIEEE Journal of Selected Topics in Quantum Electronics, vol. 10, (no. 4), pp. 840-848, 2004.
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Thin-film organic polymer phototransistorsHamilton, Michael⋅Martin, S. and Kanicki, JerzyIEEE Transactions on Electron Devices, vol. 51, (no. 6), pp. 877-885, 2004.
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2003
Effect of Illumination on Organic Polymer Thin-Film TransistorsHamilton, Michael C⋅Martin, Sandrine and Kanicki, JerzyMRS Online Proceedings Library, vol. 771, 20030101.
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Organic polymer thin film phototransistorsHamilton, Michael⋅Martin, Sandrine and Kanicki, JerzyProceedings of SPIE, vol. SPIE-5217, pp. 193-201, 2003.
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Organic‐polymer thin‐film transistors for active‐matrix flat‐panel displays?Martin, Sandrine⋅Hamilton, Michael and Kanicki, JerzyJournal of the Society for Information Display, vol. 11, (no. 3), pp. 549, September 2003.
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Source / drain contacts in organic polymer thin film transistorsMartin, Sandrine⋅Hamilton, Michael C and Kanicki, JerzyMRS Online Proceedings Library, vol. 771, 20030101.
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Time dependence of organic polymer thin film transistor currentMartin, Sandrine⋅Dassas, Laurence⋅Hamilton, Michael and Kanicki, JerzyProceedings of SPIE, vol. SPIE-5217, pp. 7-15, 2003.
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