Expertise

Advanced packaging technology; Engineering beyond Moore's Law; spin electronics; quantum devices; Physics and applications of organic/molecular and bio-inspired electronic and optoelectronic devices; nanotechnology for electronic and photonic devices; active and passive thin-film devices; cryogenic and radiation effects in semiconductor devices; nano/microelectromechanical systems for sensing applications.

His current interests and areas of research include: superconducting electronics technologies, micro/nano fabrication, packaging and integration of high-speed systems, signal and power integrity of densely-integrated systems, application of micro and nanostructures for enhanced performance of RF and microwave systems and packaging for extreme environments (both high and low temperature).

His current interests and areas of work include: physics and applications of organic, molecular and bio-inspired electronic and optoelectronic devices, nanotechnology for electronic and photonic devices, active and passive thin-film devices, cryogenic (>mK) and radiation effects in semiconductor devices, and advanced packaging and integration technologies for extreme environments (including superconducting technologies).

Communities
Electrical Engineering, Computer Engineering
Degrees
PhD, University of Michigan, Electrical engineering, 2005
MSEE, University of Michigan, 2003
BSEE, Auburn University, 2000