77 Publications (Page 2 of 4)
2017
Reliability of Ag sintering for power semiconductor die attach in high-temperature applications
Hamilton, Michael⋅Johnson, R.⋅Yu, Fang⋅Cui, Jinzi⋅Zhou, Zhangming and Fang, Kun
IEEE Transactions on Power Electronics, vol. 32, (no. 8), pp. 7083, 20170801. | Journal Article
 
Reliability of AuGe Die Attach on DBC Substrates With Different Ni Surface Finishes
Cui, Jinzi⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, (no. 10), pp. 1607, 2017-Oct.. | Journal Article
 
Reliability of Die Attach on DBC Substrates With Different Ni Surface Finishes Using BiAgX Solder
Cui, Jinzi⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, (no. 12), pp. 1950, 2017-Dec.. | Journal Article
 
Study of device instability of bottom-gate ZnO transistors with sol–gel derived channel layers
Yapabandara, Kosala⋅Yapabandara, Kosala⋅Yapabandara, Kosala⋅Mirkhani, Vahid⋅Mirkhani, Vahid⋅Mirkhani, Vahid⋅Sultan, Muhammad Shehzad⋅Sultan, Muhammad Shehzad⋅Sultan, Muhammad Shehzad⋅Ozden, Burcu⋅Ozden, Burcu⋅Ozden, Burcu⋅Khanal, Min P⋅Khanal, Min P.⋅Khanal, Min P⋅Park, Minseo⋅Park, Minseo⋅Park, Minseo⋅Wang, Shiqiang⋅Wang, Shiqiang⋅Wang, Shiqiang⋅Hamilton, Michael C.⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Chung, Yoonsung⋅Chung, Yoonsung⋅Chung, Yoonsung⋅Kim, Dong Joo⋅Kim, Dong-Joo⋅Kim, Dong-Joo⋅Sk, Mobbassar Hassan⋅Sk, Mobbassar Hassan and Sk, Mobbassar Hassan
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, vol. 35, (no. 3), pp. 3, 20170500. | Journal Article
 
Thin-Film Flip-Chip Assembly for High- Temperature Geothermal Application
Fang, Kun⋅Yu, Fang⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, (no. 2), pp. 200, 2017-Feb.. | Journal Article
2016
A 1D numerical model for rapid stress analysis in bipolar junction transistors
Gnanachchelvi, Parameshwaran⋅Gnanachchelvi, Parameshwaran⋅Wilamowski, Bogdan M⋅Wilamowski, Bogdan M⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Hussain, Safina⋅Hussain, Safina⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Hamilton, Michael C and Hamilton, Michael C
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 29, (no. 6), pp. 1179, 2016-11-00. | Journal Article
 
A digital matched filter for reverse time chaos
Phillip, Bailey J⋅Phillip, Bailey J⋅Beal, Aubrey N⋅Beal, Aubrey N⋅Dean, Robert N⋅Dean, Robert N⋅Hamilton, Michael C and Hamilton, Michael C
Chaos, vol. 26, (no. 7), Jul 2016. | Journal Article
 
A Matched Filter Developed for Chaotic Waveforms
Werner, Frank T⋅Rhea, Benjamin K⋅Beal, Aubrey N⋅Abell, William E⋅Bailey, John P⋅Harrison, Remington C⋅Dean, Robert N and Hamilton, Michael C
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2016, (no. DPC), pp. 1631, 2016-01-00. | Journal Article
 
Component Attachment with Pressureless Sintering for 300°C Applications
Yu, Fang⋅Cui, Jinzi⋅Zhou, Zhangming⋅Johnson, R. Wayne and Hamilton, Michael C
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2016, (no. HiTEC), pp. 233, 2016-05-00. | Journal Article
 
Durability of Low Melt Alloys as Thermal Interface Materials
Roy, Chandan K⋅Roy, Chandan K⋅Roy, Chandan K⋅Roy, Chandan K⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Wayne Johnson, R⋅Wayne Johnson, R⋅Wayne Johnson, R⋅Wayne Johnson, R⋅Knight, Roy W⋅Knight, Roy W⋅Knight, Roy W⋅Knight, Roy W⋅Harris, Daniel K⋅Harris, Daniel K⋅Harris, Daniel K and Harris, Daniel K
Journal of Electronic Packaging, vol. 138, (no. 1), pp. 010913-7, 2016-03-01. | Journal Article
 
Flexible superconducting Nb transmission lines on thin film polyimide for quantum computing applications
Tuckerman, David B⋅Hamilton, Michael C⋅Reilly, David J⋅Bai, Rujun⋅Hernandez, George A⋅Hornibrook, John M⋅Sellers, John A and Ellis, Charles D
Superconductor Science and Technology, vol. 29, (no. 8), pp. 84007, 2016-08-01. | Journal Article
 
Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications
Shen, Zhenzhen⋅Xu, Teng⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, (no. 3), pp. 382, 2016-March. | Journal Article
 
Thin-Film Multichip Packaging for High-Temperature Geothermal Application
Fang, Kun⋅Shen, Zhenzhen⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, (no. 5), pp. 702, 2016-May. | Journal Article
2015
Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials
Roy, Chandan K⋅Roy, Chandan K⋅Roy, Chandan K⋅Roy, Chandan K⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Johnson, R. Wayne⋅Johnson, R. Wayne⋅Johnson, R. Wayne⋅Johnson, R. Wayne⋅Knight, Roy W⋅Knight, Roy W⋅Knight, Roy W⋅Knight, Roy W⋅Harris, Daniel K⋅Harris, Daniel K⋅Harris, Daniel K and Harris, Daniel K
Microelectronics Reliability, vol. 55, (no. 12), pp. 2704, December 2015. | Journal Article
 
Conductive interpenetrating networks of polypyrrole and polycaprolactone encourage electrophysiological development of cardiac cells.
Spearman, Benjamin S⋅Spearman, Benjamin S⋅Hodge, Alexander J⋅Hodge, Alexander J⋅Porter, John L⋅Porter, John L⋅Hardy, John G⋅Hardy, John G⋅Davis, Zenda D⋅Davis, Zenda D⋅Xu, Teng⋅Xu, Teng⋅Zhang, Xinyu⋅Schmidt, Christine E⋅Schmidt, Christine E⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Lipke, Elizabeth A and Lipke, Elizabeth A
Acta biomaterialia, vol. 28, pp. 109-120, December 2015. | Journal Article
 
Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applications
Xu, Pingye and Hamilton, Michael C
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2015, (no. DPC), pp. 2094, 2015-01-00. | Journal Article
 
High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
Decrossas, Emmanuel⋅Glover, Michael D⋅Porter, Kaoru⋅Cannon, Tom⋅Stegeman, Thomas⋅Allen-McCormack, Nicholas⋅Hamilton, Michael C and Mantooth, H. Alan
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, (no. 3), pp. 313, 2015-March. | Journal Article
 
Investigation into the application of low melting temperature alloys as wet thermal interface materials
Roy, Chandan K⋅Roy, Chandan K⋅Roy, Chandan K⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Bhavnani, Sushil⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Johnson, R. Wayne⋅Johnson, R. Wayne⋅Johnson, R. Wayne⋅Nguyen, Jonathan L⋅Nguyen, Jonathan L⋅Nguyen, Jonathan L⋅Knight, Roy W⋅Knight, Roy W⋅Knight, Roy W⋅Harris, Daniel K⋅Harris, Daniel K and Harris, Daniel K
International Journal of Heat and Mass Transfer, vol. 85, pp. 1002, June 2015. | Journal Article
 
Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability
Cui, Jinzi⋅Johnson, R. Wayne and Hamilton, Michael C
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2015, (no. HiTEN), pp. 82, 2015-07-00. | Journal Article
 
Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications
Yu, Fang⋅Johnson, R. Wayne and Hamilton, Michael C
International Symposium on Microelectronics, vol. 2015, (no. 1), pp. 660, 2015-10-03. | Journal Article
 
Pressureless Sintering of Microscale Silver Paste for 300 °C Applications
Yu, Fang⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, (no. 9), pp. 1264, 2015-Sept.. | Journal Article
 
SiC Power Device Die Attach for Extreme Environments
Shen, Zhenzhen⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Electron Devices, vol. 62, (no. 2), pp. 353, 2015-Feb.. | Journal Article
 
Solution-Deposited Carbon Nanotube Flip Chip Interconnect for High-Frequency Applications
Xu, Pingye and Hamilton, Michael C
IEEE Microwave and Wireless Components Letters, vol. 25, (no. 4), pp. 231, 2015-April. | Journal Article
2014
Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology
Dean, Robert N⋅Dean, Robert N⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Baginski, Michael E and Baginski, Michael E
Journal of Microelectronics and Electronic Packaging, vol. 11, (no. 3), pp. 127, 2014-07-00. | Journal Article
 
Characterization of Bi-Ag-X Solder for High Temperature SiC Die Attach
Shen, Zhenzhen⋅Fang, Kun⋅Johnson, R. Wayne and Hamilton, Michael C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, (no. 11), pp. 1784, 2014-Nov.. | Journal Article