47 Publications (Page 1 of 2)
2019
First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion
Jaeger, Richard C and Suhling, Jeffrey C
IEEE Sensors Journal, vol. 19, (no. 23), pp. 11317, 2019-Dec.1,-1. | Journal Article
 
First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide
Jaeger, Richard CChen, JunSuhling, Jeffrey C and Fursin, Leonid
IEEE Sensors Journal, vol. 19, (no. 15), pp. 6045, 2019-Aug.1,-1. | Journal Article
2018
Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
Jaeger, Richard CSuhling, Jeffrey C and Chen, Jun
Journal of Electronic Packaging, vol. 140, (no. 4), 2018-12-01. | Journal Article
 
Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Jaeger, Richard CMotalab, MohammadHussain, Safina and Suhling, Jeffrey C
Journal of Electronic Packaging, vol. 140, (no. 1), 2018-03-01. | Journal Article
2017
Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation
Hasnine, MdSuhling, Jeffrey and Bozack, Michael
Journal of Materials Science: Materials in Electronics, vol. 28, (no. 18), pp. 13506, 20170900. | Journal Article
 
Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling
Shen, ChaoboHai, ZhouZhao, CongZhang, JiaweiEvans, John LBozack, Michael J and Suhling, Jeffrey C
Materials (Basel, Switzerland), vol. 10, (no. 5), pp. 451, 2017-Apr-26. | Journal Article
2016
A 1D numerical model for rapid stress analysis in bipolar junction transistors
Gnanachchelvi, ParameshwaranGnanachchelvi, ParameshwaranWilamowski, Bogdan MWilamowski, Bogdan MJaeger, Richard CJaeger, Richard CHussain, SafinaHussain, SafinaSuhling, Jeffrey CSuhling, Jeffrey CHamilton, Michael C and Hamilton, Michael C
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 29, (no. 6), pp. 1179, 2016-11-00. | Journal Article
 
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
Mustafa, MuhannadMustafa, MuhannadSuhling, Jeffrey CSuhling, Jeffrey CLall, Pradeep and Lall, Pradeep
Microelectronics Reliability, vol. 56, pp. 147, January 2016. | Journal Article
2015
Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes
Hai, ZhouZhang, JiaweiShen, ChaoboEvans, John LBozack, Michael JBasit, Munshi M and Suhling, Jeffrey C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, (no. 6), pp. 837, 2015-June. | Journal Article
2014
Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°C
Akkara, Francy JAkkara, Francy JGoteti, Uday SGoteti, Uday SJaeger, Richard CJaeger, Richard CHamilton, Michael CHamilton, Michael CPalmer, Michael JPalmer, Michael JSuhling, Jeffrey C and Suhling, Jeffrey C
International Symposium on Microelectronics, vol. 2014, (no. 1), pp. 504, 2014-01-00. | Journal Article
 
Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
Jaeger, Richard CMotalab, MohammadHussain, Safina and Suhling, Jeffrey C
Journal of Electronic Packaging, vol. 136, (no. 4), pp. 41014, 2014-12-01. | Journal Article
 
Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
Goteti, Uday SAkkara, Francy JJaeger, Richard CHamilton, Michael C and Suhling, Jeffrey C
International Symposium on Microelectronics, vol. 2014, (no. 1), pp. 487, 2014-01-00. | Journal Article
2013
Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages
Zhang, JiaweiHai, ZhouThirugnanasambandam, SivasubramanianEvans, John LBozack, Michael JZhang, Yifei and Suhling, Jeffrey C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, (no. 8), pp. 1357, 2013-Aug.. | Journal Article
2012
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
Roberts, Jordan CRoberts, Jordan CMotalab, MohammadMotalab, MohammadHussain, SafinaHussain, SafinaSuhling, Jeffrey CSuhling, Jeffrey CJaeger, Richard CJaeger, Richard CLall, Pradeep and Lall, Pradeep
Journal of Electronic Packaging, vol. 134, (no. 3), 2012-09-01. | Journal Article
2011
Development of a Silicon Nitride High Temperature Power Module
Palmer, Michael JJohnson, R. WayneMotalab, MohammadSuhling, Jeffrey and Scofield, James D
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2011, (no. HITEN), pp. 179, 2011-01-00. | Journal Article
 
Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys
Bozack, M. JSuhling, Jeffrey CZhang, Y.Cai, Z. and Lall, Pradeep
Journal of Electronic Materials, vol. 40, (no. 10), pp. 2093-2104, Oct 2011. | Journal Article
2010
Combined Controller for Test System of High Capacity Hydraulic Pump
Meng, Wenjun and Suhling, Jeffrey C
Journal of Dynamic Systems, Measurement, and Control, vol. 132, (no. 5), pp. 54502, 2010-09-01. | Journal Article
2009
A review of mechanical properties of lead-free solders for electronic packaging
Ma, Hongtao and Suhling, Jeffrey
Journal of Materials Science, vol. 44, (no. 5), pp. 1158, 20090300. | Journal Article
2008
Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From C to C
Cho, Chun-HyungJaeger, Richard C and Suhling, Jeffrey C
IEEE Sensors Journal, vol. 8, (no. 8), 2008. | Journal Article
 
Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing
Cho, Chun-HyungJaeger, Richard CSuhling, Jeffrey CKang, Yanling and Mian, Ahsan
IEEE Sensors Journal, vol. 8, (no. 4), 2008. | Journal Article
 
Evaluation of the Temperature Dependence of the Combined Piezoresistive Coefficients of (111) Silicon Utilizing Chip-on-Beam and Hydrostatic Calibration
Cho, Chun-HyungJaeger, Richard C and Suhling, Jeffrey C
Journal of the Korean Physical Society, vol. 52, (no. 3), pp. 620, 2008-03-15. | Journal Article
 
The Effect of the Transverse Sensitivity on Measurement of the Piezoresistive Coefficients of Silicon
Cho, Chun-HyungJaeger, Richard C and Suhling, Jeffrey C
Japanese Journal of Applied Physics, vol. 47, (no. 5), pp. 3656, 2008-05-00. | Journal Article
2006
Prognostics and Health Management of Electronic Packaging
Lall, PradeepIslam, MNRahim, MK and Suhling, Jeffrey C
IEEE Transactions on Components and Packaging Technologies, vol. 29, (no. 3), 2006. | Journal Article
2005
Die stress characterization in flip chip on laminate assemblies
Rahim, M. KSuhling, Jeffrey CCopeland, D. SIslam, M. SJaeger, Richard CLall, Pradeep and Johnson, R. W
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 415-429, 2005. | Journal Article
 
Measurement of the temperature dependent constitutive behavior of underfill encapsulants
Islam, M. SSuhling, Jeffrey C and Lall, Pradeep
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 467-476, 2005. | Journal Article