47 Publications (Page 1 of 2)
2019
First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion
Jaeger, Richard C and Suhling, Jeffrey C
IEEE Sensors Journal, vol. 19, (no. 23), pp. 11317, 2019-Dec.1,-1. | Journal Article
 
First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide
Jaeger, Richard C⋅Chen, Jun⋅Suhling, Jeffrey C and Fursin, Leonid
IEEE Sensors Journal, vol. 19, (no. 15), pp. 6045, 2019-Aug.1,-1. | Journal Article
2018
Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
Jaeger, Richard C⋅Suhling, Jeffrey C and Chen, Jun
Journal of Electronic Packaging, vol. 140, (no. 4), 2018-12-01. | Journal Article
 
Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Jaeger, Richard C⋅Motalab, Mohammad⋅Hussain, Safina and Suhling, Jeffrey C
Journal of Electronic Packaging, vol. 140, (no. 1), 2018-03-01. | Journal Article
2017
Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation
Hasnine, Md⋅Suhling, Jeffrey and Bozack, Michael
Journal of Materials Science: Materials in Electronics, vol. 28, (no. 18), pp. 13506, 20170900. | Journal Article
 
Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling
Shen, Chaobo⋅Shen, Chaobo⋅Hai, Zhou⋅Hai, Zhou⋅Zhao, Cong⋅Zhao, Cong⋅Zhang, Jiawei⋅Zhang, Jiawei⋅Evans, John L⋅Evans, John L⋅Bozack, Michael J⋅Bozack, Michael J⋅Suhling, Jeffrey C and Suhling, Jeffrey C
Materials (Basel, Switzerland), vol. 10, (no. 5), pp. 451, 2017-Apr-26. | Journal Article
2016
A 1D numerical model for rapid stress analysis in bipolar junction transistors
Gnanachchelvi, Parameshwaran⋅Gnanachchelvi, Parameshwaran⋅Wilamowski, Bogdan M⋅Wilamowski, Bogdan M⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Hussain, Safina⋅Hussain, Safina⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Hamilton, Michael C and Hamilton, Michael C
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 29, (no. 6), pp. 1179, 2016-11-00. | Journal Article
 
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
Mustafa, Muhannad⋅Mustafa, Muhannad⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Lall, Pradeep and Lall, Pradeep
Microelectronics Reliability, vol. 56, pp. 147, January 2016. | Journal Article
2015
Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes
Hai, Zhou⋅Zhang, Jiawei⋅Shen, Chaobo⋅Evans, John L⋅Bozack, Michael J⋅Basit, Munshi M and Suhling, Jeffrey C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, (no. 6), pp. 837, 2015-June. | Journal Article
2014
Characterization of Thermally Induced Stress in IC Packages Using PiFETs Over a Temperature Range of −180°C to 80°C
Akkara, Francy J⋅Akkara, Francy J⋅Goteti, Uday S⋅Goteti, Uday S⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Hamilton, Michael C⋅Hamilton, Michael C⋅Palmer, Michael J⋅Palmer, Michael J⋅Suhling, Jeffrey C and Suhling, Jeffrey C
International Symposium on Microelectronics, vol. 2014, (no. 1), pp. 504, 2014-01-00. | Journal Article
 
Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
Jaeger, Richard C⋅Motalab, Mohammad⋅Hussain, Safina and Suhling, Jeffrey C
Journal of Electronic Packaging, vol. 136, (no. 4), pp. 41014, 2014-12-01. | Journal Article
 
Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
Goteti, Uday S⋅Akkara, Francy J⋅Jaeger, Richard C⋅Hamilton, Michael C and Suhling, Jeffrey C
International Symposium on Microelectronics, vol. 2014, (no. 1), pp. 487, 2014-01-00. | Journal Article
2013
Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages
Zhang, Jiawei⋅Hai, Zhou⋅Thirugnanasambandam, Sivasubramanian⋅Evans, John L⋅Bozack, Michael J⋅Zhang, Yifei and Suhling, Jeffrey C
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, (no. 8), pp. 1357, 2013-Aug.. | Journal Article
2012
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
Roberts, Jordan C⋅Roberts, Jordan C⋅Motalab, Mohammad⋅Motalab, Mohammad⋅Hussain, Safina⋅Hussain, Safina⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Lall, Pradeep and Lall, Pradeep
Journal of Electronic Packaging, vol. 134, (no. 3), 2012-09-01. | Journal Article
2011
Development of a Silicon Nitride High Temperature Power Module
Palmer, Michael J⋅Johnson, R. Wayne⋅Motalab, Mohammad⋅Suhling, Jeffrey and Scofield, James D
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), vol. 2011, (no. HITEN), pp. 179, 2011-01-00. | Journal Article
 
Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys
Bozack, M. J⋅Suhling, Jeffrey C⋅Zhang, Y.⋅Cai, Z. and Lall, Pradeep
Journal of Electronic Materials, vol. 40, (no. 10), pp. 2093-2104, Oct 2011. | Journal Article
2010
Combined Controller for Test System of High Capacity Hydraulic Pump
Meng, Wenjun and Suhling, Jeffrey C
Journal of Dynamic Systems, Measurement, and Control, vol. 132, (no. 5), pp. 54502, 2010-09-01. | Journal Article
2009
A review of mechanical properties of lead-free solders for electronic packaging
Ma, Hongtao and Suhling, Jeffrey
Journal of Materials Science, vol. 44, (no. 5), pp. 1158, 20090300. | Journal Article
2008
Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From C to C
Cho, Chun-Hyung⋅Jaeger, Richard C and Suhling, Jeffrey C
IEEE Sensors Journal, vol. 8, (no. 8), 2008. | Journal Article
 
Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing
Cho, Chun-Hyung⋅Jaeger, Richard C⋅Suhling, Jeffrey C⋅Kang, Yanling and Mian, Ahsan
IEEE Sensors Journal, vol. 8, (no. 4), 2008. | Journal Article
 
Evaluation of the Temperature Dependence of the Combined Piezoresistive Coefficients of (111) Silicon Utilizing Chip-on-Beam and Hydrostatic Calibration
Cho, Chun-Hyung⋅Jaeger, Richard C and Suhling, Jeffrey C
Journal of the Korean Physical Society, vol. 52, (no. 3), pp. 620, 2008-03-15. | Journal Article
 
The Effect of the Transverse Sensitivity on Measurement of the Piezoresistive Coefficients of Silicon
Cho, Chun-Hyung⋅Jaeger, Richard C and Suhling, Jeffrey C
Japanese Journal of Applied Physics, vol. 47, (no. 5), pp. 3656, 2008-05-00. | Journal Article
2006
Prognostics and Health Management of Electronic Packaging
Lall, Pradeep⋅Islam, MN⋅Rahim, MK and Suhling, Jeffrey C
IEEE Transactions on Components and Packaging Technologies, vol. 29, (no. 3), 2006. | Journal Article
2005
Die stress characterization in flip chip on laminate assemblies
Rahim, M. K⋅Suhling, Jeffrey C⋅Copeland, D. S⋅Islam, M. S⋅Jaeger, Richard C⋅Lall, Pradeep and Johnson, R. W
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 415-429, 2005. | Journal Article
 
Measurement of the temperature dependent constitutive behavior of underfill encapsulants
Islam, M. S⋅Suhling, Jeffrey C and Lall, Pradeep
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 467-476, 2005. | Journal Article