47 Publications (Page 2 of 2)
2004
Thermal cycling reliability of lead-free chip resistor solder joints
Suhling, Jeffrey C⋅Gale, H. S⋅Johnson, Wayne⋅Islam, M. N⋅Shete, Tushar⋅Lall, Pradeep⋅Bozack, Michael J⋅Evans, John L⋅Seto, Ping⋅Gupta, Tarun and Thompson, James R
Soldering & Surface Mount Technology, vol. 16, (no. 2), pp. 77-87, 2004. | Journal Article
 
The van der Pauw stress sensor
Mian, Ahsan⋅Suhling, Jeffrey C and Jaeger, Richard C
IEEE Sensors Journal, vol. 6, (no. 2), pp. 340-356, 2004. | Journal Article
2001
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
Bradley, A. T⋅Jaeger, Richard C⋅Suhling, Jeffrey C and O'Connor, K. J
IEEE Transactions on Electron Devices, vol. 48, (no. 9), pp. 2009-2015, 2001. | Journal Article
 
Silicon piezoresistive stress sensors and their application in electronic packaging
Suhling, Jeffrey C and Jaeger, Richard C
IEEE Sensors Journal, vol. 1, (no. 1), pp. 14-30, 2001. | Journal Article
2000
CMOS stress sensors on (100) silicon
Jaeger, Richard C⋅Suhling, Jeffrey C⋅Ramani, Ramanathan⋅Bradley, Arthur T and Xu, Jianping
IEEE Journal of Solid-State Circuits, vol. 35, (no. 1), pp. 85-95, 2000. | Journal Article
1999
In-situ stress state measurements during chip-on-board assembly
Zou, Y.⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅Jaeger, Richard C and Mian, Ahsan
IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, (no. 1), pp. 38-52, 1999. | Journal Article
1998
Three-dimensional die surface stress measurements in delaminated and non-delaminated plastic packages
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Ali, H.
PROC ELECTRON COMPON TECHNOL CONF. pp. 1223-1234. 1998, 1998. | Journal Article
 
Three-dimensional die surface stress measurements in delaminated and non-delaminated plastic packages
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Ali, H.
pp. 1223-1234, 1998. | Journal Article
1997
Characterization of plastic packages using (100) silicon stress test chips
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C⋅Lin, ST⋅Nguyen, L. and Gee, SA
Vol. 22, vol. 22, pp. 15-21, 1997. | Journal Article
 
Evaluation of die stress using Van der Pauw sensors
Mian, AKM⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Wilamowski, Dan M
Vol. 22, vol. 22, pp. 59-67, 1997. | Journal Article
 
Hydrostatic response of piezoresistive stress sensors
Kang, Y.⋅Mian, AKM⋅Suhling, Jeffrey C and Jaeger, Richard C
Vol. 22, vol. 22, pp. 29-36, 1997. | Journal Article
 
Measurement of die stress in advanced electronic packaging for space and terrestrial applications
Suhling, Jeffrey C⋅Lin, S. T⋅Moral, R. J⋅Johnson, Wayne and Jaeger, Richard C
Space Technology & Applications International Forum - Conference on Applications of Thermophysics in Microgravity, 1st and Conference on Commercial Development of Space, 2nd, Albuquerque, NM; UNITED STATES; 26-30 Jan. 1997. 1997. | Conference Proceeding
1995
Effects of stress-induced mismatches on CMOS analog circuits
Jaeger, Richard C⋅Ramani, Ramanathan and Suhling, Jeffrey C
The 1995 International Symposium on VLSI Technology, Systems, and Applications; Taipei; Taiwan; 31 May-02 June 1995. 1995. | Conference Proceeding
1994
Reliability of plastic quad flat pack solder joints in potted automotive engine controllers
WHITE, J. D⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅KNIGHT, R. W and ROMANCZUK, C. S
Proceedings, 27th International Symposium on Microelectronics, Boston, MA; 15-17 Nov. 1994. 1994. | Conference Proceeding
 
Reliability of plastic quad flat pack solder joints in potted automotive engine controllers
White, J. D⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅Knight, R. W and Romanczuk, C. S
International Symposium on Microelectronics, 27th, Boston, MA; UNITED STATES; 15-17 Nov. 1994. 1994. | Conference Proceeding
 
Solder joint reliability of surface mount chip resistors / capacitors on insulated metal substrates
Suhling, Jeffrey C⋅Johnson, Wayne⋅WHITE, J. D⋅MATTHAI, K. W and KNIGHT, R. W
Proceedings, 44th Electronic Components and Technology Conference, Washington DC; 1-4 May 1994. 1994. | Conference Proceeding
1993
Piezoresistive sensor chip for measurement of stress in electronic packaging.
Jaeger, Richard C⋅Suhling, Jeffrey C⋅Carey, Martin T and Johnson, Wayne
1993 Proceedings of the 43rd Electronic Components and Technology Conference; Orlando, FL; USA; 01-04 June 1993. 1993. | Conference Proceeding
1992
Errors associated with the design and calibration of piezoresistive stress sensors in (100) silicon.
Jaeger, Richard C⋅Suhling, Jeffrey C and Ramani, Ramanathan
ASME, vol. 1, pp. 447-456, 1992. | Journal Article
 
Piezoresistive stress sensors on (110) silicon wafers
Kang, Y. L⋅Suhling, Jeffrey C and Jaeger, Richard C
International Congress on Experimental Mechanics, 7th, Las Vegas, NV; UNITED STATES; 8-11 June 1992. 1992. | Conference Proceeding
1991
Piezoresistive sensors for measurement of thermally-induced stresses in microelectronics
Suhling, Jeffrey C⋅BEATY, R. E⋅Jaeger, Richard C and Johnson, Wayne
1991 SEM Spring Conference on Experimental Mechanics, Milwaukee, WI; UNITED STATES; 10-13 June 1991. 1991. | Conference Proceeding
1990
Continuum Models for the Mechanical Response of Paper and Paper Composites: Past, Present, and Future
Suhling, Jeffrey C
MRS Online Proceedings Library, vol. 197, 19900101. | Journal Article
1985
CONSTITUTIVE RELATIONS AND FAILURE PREDICTIONS FOR NONLINEAR ORTHOTROPIC MEDIA (PAPERBOARD, BURST TEST, SHADOW MOIRE, BIAXIAL) (Dissertation)
Suhling, Jeffrey C (1985).