52 Publications (Page 1 of 3)
2017
Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper-Aluminum Wirebond in PEMs
Lall, Pradeep⋅Deshpande, Shantanu and Nguyen, Luu
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, (no. 8), pp. 1292, 2017-Aug.. | Journal Article
2016
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
Mustafa, Muhannad⋅Mustafa, Muhannad⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Lall, Pradeep and Lall, Pradeep
Microelectronics Reliability, vol. 56, pp. 147, January 2016. | Journal Article
 
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
Lall, Pradeep⋅Zhang, Di⋅Yadav, Vikas and Locker, David
Microelectronics Reliability, vol. 62, pp. 17, July 2016. | Journal Article
 
Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics
Lall, Pradeep⋅Mirza, Kazi Mahmud⋅Harsha, Mahendra and Goebel, Kai
IEEE Transactions on Device and Materials Reliability, vol. 16, (no. 3), pp. 317, 2016-Sept.. | Journal Article
 
Microstructural Indicators for Prognostication of Copper-Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity
Lall, Pradeep⋅Deshpande, Shantanu⋅Nguyen, Luu and Murtuza, Masood
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, (no. 4), pp. 585, 2016-April. | Journal Article
2015
Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter
Lall, Pradeep and Zhang, Hao
Journal of Electronic Packaging, vol. 137, (no. 2), 2015-06-01. | Journal Article
 
Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage
Lall, Pradeep⋅Patel, Kewal and Narayan, Vikalp
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, (no. 9), pp. 1375, 2015-Sept.. | Journal Article
 
Prediction of L70 Life and Assessment of Color Shift for Solid-State Lighting Using Kalman Filter and Extended Kalman Filter-Based Models
Lall, Pradeep and Wei, Junchao
IEEE Transactions on Device and Materials Reliability, vol. 15, (no. 1), pp. 68, 2015-March. | Journal Article
 
Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging
Lall, Pradeep⋅Sakalaukus, Peter and Davis, Lynn
IEEE Access, vol. 3, pp. 542, 20150000. | Journal Article
 
Stress–Strain Behavior of SAC305 at High Strain Rates
Lall, Pradeep⋅Shantaram, Sandeep⋅Suhling, Jeff and Locker, David
Journal of Electronic Packaging, vol. 137, (no. 1), pp. 11010, 2015-03-01. | Journal Article
2014
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
Lall, Pradeep and Lowe, Ryan
Journal of Electronic Packaging, vol. 136, (no. 4), pp. 41013, 2014-12-01. | Journal Article
2012
Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration
Lall, Pradeep⋅Gupta, Prashant and Angral, Arjun
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, (no. 11), pp. 1902-1918, 2012. | Journal Article
 
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
Roberts, Jordan C⋅Roberts, Jordan C⋅Motalab, Mohammad⋅Motalab, Mohammad⋅Hussain, Safina⋅Hussain, Safina⋅Suhling, Jeffrey C⋅Suhling, Jeffrey C⋅Jaeger, Richard C⋅Jaeger, Richard C⋅Lall, Pradeep and Lall, Pradeep
Journal of Electronic Packaging, vol. 134, (no. 3), 2012-09-01. | Journal Article
 
Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
Lall, Pradeep⋅Shirgaokar, Aniket and Arunachalam, Dinesh
Journal of Electronic Packaging, vol. 134, (no. 3), 2012-09-01. | Journal Article
 
Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact
Lall, Pradeep⋅Lowe, Ryan and Goebel, Kai
Journal of Electronic Packaging, vol. 134, (no. 2), 2012-06-01. | Journal Article
2011
Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys
Bozack, M. J⋅Suhling, Jeffrey C⋅Zhang, Y.⋅Cai, Z. and Lall, Pradeep
Journal of Electronic Materials, vol. 40, (no. 10), pp. 2093-2104, Oct 2011. | Journal Article
 
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads
Lall, Pradeep⋅Bhat, C⋅Hande, M⋅More, V⋅Vaidya, R and Goebel, K
IEEE Transactions on Industrial Electronics, vol. 58, (no. 7), pp. 2616, 2011-July. | Journal Article
2010
Time-Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems
Lall, Pradeep⋅Gupta, Prashant⋅Kulkarni, Manish and Hofmeister, James
IEEE Transactions on Electronics Packaging Manufacturing, vol. 33, (no. 4), pp. 302, 2010-Oct.. | Journal Article
2009
Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics
Lall, Pradeep⋅Gupte, S.⋅Choudhary, P. and Darveaux, R.
IEEE Transactions on Components and Packaging Technologies, vol. 32, (no. 2), pp. 365-377, 2009. | Journal Article
 
Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock
Lall, Pradeep⋅Iyengar, D.⋅Shantaram, S. and Panchagade, D.
Strain. Newcastle-upon-Tyne, vol. 45, (no. 3), pp. 267-282, 2009. | Journal Article
 
High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics
Lall, Pradeep⋅Panchagade, D. R⋅Iyengar, D.⋅Shantaram, S. and Schrier, H.
IEEE Transactions on Components and Packaging Technologies, vol. 32, (no. 2), 2009. | Journal Article
 
Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
Lall, Pradeep⋅Islam, N.⋅Choudhary, P. and Suhling, JC
IEEE Transactions on Components and Packaging Technologies, vol. 32, (no. 1), pp. 135-144, 2009. | Journal Article
 
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads
Lall, Pradeep⋅Hande, Madhura⋅Bhat, Chandan⋅More, Vikrant and Vaidya, Rahul
Microelectronics Reliability, vol. 49, (no. 8), pp. 838, 2009. | Journal Article
 
Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads
Lall, Pradeep⋅Choudhary, P.⋅Gupte, S. and Hofmeister, J.
IEEE Transactions on Components and Packaging Technologies, vol. 32, (no. 3), pp. 600-616, 2009. | Journal Article
2008
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
Lall, Pradeep⋅Panchagade, D. R⋅Choudhary, P.⋅Gupte, S. and Suhling, JC
IEEE Transactions on Components and Packaging Technologies, vol. 31, (no. 1), pp. 104-113, 2008. | Journal Article