61 Publications (Page 1 of 3)
2008
Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From C to C
Cho, Chun-Hyung⋅Jaeger, Richard C and Suhling, Jeffrey C
IEEE Sensors Journal, vol. 8, (no. 8), 2008. | Journal Article
 
Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing
Cho, Chun-Hyung⋅Jaeger, Richard C⋅Suhling, Jeffrey C⋅Kang, Yanling and Mian, Ahsan
IEEE Sensors Journal, vol. 8, (no. 4), 2008. | Journal Article
2006
Effect of nucleation site spacing on the pool boiling characteristics of a structured surface
Nimkar, Nitesh D⋅Bhavnani, Sushil H and Jaeger, Richard C
International Journal of Heat and Mass Transfer, vol. 49, (no. 17-18), pp. 2829-2839, 2006. | Journal Article
2005
Die stress characterization in flip chip on laminate assemblies
Rahim, M. K⋅Suhling, Jeffrey C⋅Copeland, D. S⋅Islam, M. S⋅Jaeger, Richard C⋅Lall, Pradeep and Johnson, R. W
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 415-429, 2005. | Journal Article
2004
Development of an anodically-bonded test surface to obtain fundamental liquid immersion thermal management data for electronic devices
Nimkar, Nitesh D⋅Bhavnani, Sushil H⋅Ellis, Charles D and Jaeger, Richard C
Sensors and Actuators A: Physical, vol. 113, (no. 2), pp. 212-217, 2004. | Journal Article
 
The van der Pauw stress sensor
Mian, Ahsan⋅Suhling, Jeffrey C and Jaeger, Richard C
IEEE Sensors Journal, vol. 6, (no. 2), pp. 340-356, 2004. | Journal Article
2003
A New Baccalaureate Program in Wireless Engineering
Nelson, Victor P⋅Chapman, Richard O and Jaeger, Richard C
2003 ASEE Annual Conference & Exposition: Staying in Tune with Engineering Education; Nashville, TN; USA; 22-25 June 2003. 2003. | Conference Proceeding
2001
Piezoresistive characteristics of short-channel MOSFETs on (100) silicon
Bradley, A. T⋅Jaeger, Richard C⋅Suhling, Jeffrey C and O'Connor, K. J
IEEE Transactions on Electron Devices, vol. 48, (no. 9), pp. 2009-2015, 2001. | Journal Article
 
Silicon piezoresistive stress sensors and their application in electronic packaging
Suhling, Jeffrey C and Jaeger, Richard C
IEEE Sensors Journal, vol. 1, (no. 1), pp. 14-30, 2001. | Journal Article
2000
CMOS stress sensors on (100) silicon
Jaeger, Richard C⋅Suhling, Jeffrey C⋅Ramani, Ramanathan⋅Bradley, Arthur T and Xu, Jianping
IEEE Journal of Solid-State Circuits, vol. 35, (no. 1), pp. 85-95, 2000. | Journal Article
 
Influence of Ge grading on the bias and temperature characteristics of SiGe HBT's for precision analog circuits
Salmon, Stacey L⋅Cressler, John D⋅Jaeger, Richard C and Harame, David L
IEEE Transactions on Electron Devices, vol. 47, (no. 2), pp. 292-298, 2000. | Journal Article
 
Toward optimizing enhanced surfaces for passive immersion cooled heat sinks
Baldwin, C. S⋅Bhavnani, Sushil H and Jaeger, Richard C
IEEE Transactions on Components and Packaging Technologies, vol. 23, (no. 1), pp. 70-79, 2000. | Journal Article
1999
In-situ stress state measurements during chip-on-board assembly
Zou, Y.⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅Jaeger, Richard C and Mian, Ahsan
IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, (no. 1), pp. 38-52, 1999. | Journal Article
 
Neuro-fuzzy architecture for CMOS implementation
Wilamowski, Dan M⋅Jaeger, Richard C and Kaynak, MO
IEEE Transactions on Industrial Electronics, vol. 46, (no. 6), pp. 1132-1136, 1999. | Journal Article
1998
Three-dimensional die surface stress measurements in delaminated and non-delaminated plastic packages
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Ali, H.
PROC ELECTRON COMPON TECHNOL CONF. pp. 1223-1234. 1998, 1998. | Journal Article
 
Three-dimensional die surface stress measurements in delaminated and non-delaminated plastic packages
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Ali, H.
pp. 1223-1234, 1998. | Journal Article
1997
Advances in stress test chips
Jaeger, Richard C and Suhling, Jeffrey C
Vol. 22, vol. 22, pp. 1-5, 1997. | Journal Article
 
Characterization of plastic packages using (100) silicon stress test chips
Zou, Y.⋅Suhling, Jeffrey C⋅Jaeger, Richard C⋅Lin, ST⋅Nguyen, L. and Gee, SA
Vol. 22, vol. 22, pp. 15-21, 1997. | Journal Article
 
Evaluation of die stress using Van der Pauw sensors
Mian, AKM⋅Suhling, Jeffrey C⋅Jaeger, Richard C and Wilamowski, Dan M
Vol. 22, vol. 22, pp. 59-67, 1997. | Journal Article
 
Hydrostatic response of piezoresistive stress sensors
Kang, Y.⋅Mian, AKM⋅Suhling, Jeffrey C and Jaeger, Richard C
Vol. 22, vol. 22, pp. 29-36, 1997. | Journal Article
 
Measurement of die stress in advanced electronic packaging for space and terrestrial applications
Suhling, Jeffrey C⋅Lin, S. T⋅Moral, R. J⋅Johnson, Wayne and Jaeger, Richard C
Space Technology & Applications International Forum - Conference on Applications of Thermophysics in Microgravity, 1st and Conference on Commercial Development of Space, 2nd, Albuquerque, NM; UNITED STATES; 26-30 Jan. 1997. 1997. | Conference Proceeding
 
Neutral base recombination and its influence on the temperature dependence of Early voltage and current gain-Early voltage product in UHV/CVD SiGe heterojunction bipolar transistors
Joseph, A. J⋅Cressler, John D⋅Richey, D. M⋅Jaeger, Richard C and Harame, D. L
IEEE Transactions on Electron Devices, vol. 44, (no. 3), pp. 404-413, 1997. | Journal Article
1996
CMOS implementation of a pulse-coupled neuron cell
Wilamowski, Dan M⋅Jaeger, Richard C⋅Padgett, Mary L and Myers, Lawrence J
The 1996 IEEE International Conference on Neural Networks, ICNN. Part 2 (of 4); Washington, DC; USA; 03-06 June 1996. 1996. | Conference Proceeding
 
Evidence for non-equilibrium base transport in Si and SiGe bipolar transistors at cryogenic temperatures
Richey, D. M⋅Joseph, A. J⋅Cressler, John D and Jaeger, Richard C
Solid-State Electronics:An International Journal, vol. 39, (no. 6), pp. 785-789, 1996. | Journal Article
 
Implementation of RBF type networks by MLP networks
Wilamowski, Dan M and Jaeger, Richard C
The 1996 IEEE International Conference on Neural Networks, ICNN. Part 3 (of 4); Washington, DC; USA; 03-06 June 1996. 1996. | Conference Proceeding