Areas of Research
- Advanced Materials for Electronics Packaging
- Power Semiconductor Modules
- Reliability of Power Electronic Components
- Thermal Measurements
His research interests entail all aspects of the reliability of power semiconductor modules. His expertise includes junction temperature measurement, condition monitoring, accelerated lifetime testing, and development of custom and intelligent power modules. He is also focused on advanced material technology to enable ultra-reliable semiconductors, for example by using liquid-metal as an alternative to traditional packaging materials.
