111 Publications (Page 4 of 5)
2006
Rotary ultrasonic machining of titanium alloy: effects of machining variables.
Churi, N. J⋅Pei, Z J and Treadwell, C.
Machining Science and Technology, vol. 10, (no. 3), pp. 300-321, 2006. | Journal Article
 
Simultaneous double side grinding of silicon wafers: a literature review.
Li, Zhichao⋅Pei, Z J and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 46, (no. 12-13), pp. 1449-1458, 2006. | Journal Article
 
USING HOLLYWOOD MOVIES AS A SUPPLEMENTARY TOOL TO TEACH MANUFACTURING PROCESSES
Pei, Z J
2006 ASEE Annual Conference & Exposition: Excellence in Education; Chicago, IL; USA; 18-21 June 2006. 2006. | Conference Proceeding
2005
A grinding-based manufacturing method for silicon wafers: an experimental investigation
Pei, Z J⋅Fisher, Graham R⋅Bhagavat, Milind and Kassir, S.
International Journal of Machine Tools & Manufacture, vol. 45, (no. 10), pp. 1140-1151, 2005. | Journal Article
 
Development of an innovative coolant system for rotary ultrasonic machining
Li, Zhichao⋅Jiao, Y.⋅Deines, T. W⋅Pei, Z J and Treadwell, C.
International Journal of Manufacturing Technology and Management, vol. 7, (no. 2-4), pp. 318-328, 2005. | Journal Article
 
Experimental observation of tool wear in rotary ultrasonic machining of advanced ceramics
Zeng, W. M⋅Li, Zhichao⋅Pei, Z J and Treadwell, C.
International Journal of Machine Tools & Manufacture, vol. 45, (no. 12-13), pp. 1468-1473, 2005. | Journal Article
 
Fine grinding of silicon wafers: effects of chuck shape on grinding marks
Sun, Wangping⋅Pei, Z J and Fisher, G. R
International Journal of Machine Tools & Manufacture, vol. 45, (no. 6), pp. 673-686, 2005. | Journal Article
 
Fine grinding of silicon wafers: machine configurations for spindle angle adjustments
Sun, Wangping⋅Pei, Z J and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 45, (no. 1), pp. 51-61, 2005. | Journal Article
 
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
Sun, X. K⋅Xin, X. J and Pei, Z J
Journal of Electronic Packaging (Transactions of the ASME), vol. 127, (no. 2), pp. 189-192, 2005. | Journal Article
 
Fuzzy adaptive networks in machining process modelling: dimensional error prediction for turning operations
Jiao, Y.⋅Pei, Z J⋅Lei, S.⋅Lee, E. S and Fisher, G. R
International Journal of Production Research, vol. 43, (no. 14), pp. 2931-2948, Jul 15, 2005. | Journal Article
 
Rotary ultrasonic machining of ceramic matrix composites: feasibility study and designed experiments
Li, Zhichao⋅Jiao, Y.⋅Deines, T. W⋅Pei, Z J and Treadwell, C.
International Journal of Machine Tools & Manufacture, vol. 45, (no. 12-13), pp. 1402-1411, 2005. | Journal Article
 
Rotary ultrasonic machining of ceramics: design of experiments
Jiao, Yue⋅Hu, Ping⋅Pei, Z J and Treadwell, Clyde
International Journal of Manufacturing Technology and Management, vol. 7, (no. 2-4), pp. 192-206, 2005. | Journal Article
 
Study on Edge Chipping in Rotary Ultrasonic Machining of Ceramics: An Integration of Designed Experiments and Finite Element Method Analysis
Jiao, Yue⋅Treadwell, C.⋅Liu, W. J⋅Pei, Z J and Xin, X. J
Journal of Manufacturing Science and Engineering (Transactions of the ASME), vol. 127, (no. 4), pp. 752-758, 2005. | Journal Article
2004
An experimental investigation into soft-pad grinding of wire-sawn silicon wafers.
Pei, Z J⋅Kassir, S.⋅Bhagavat, Milind and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 44, (no. 2-3), pp. 299-306, 2004. | Journal Article
 
Fine grinding of silicon wafers: a mathematical model for the wafer shape.
Sun, Wangping⋅Pei, Z J and Fisher, G. R
International Journal of Machine Tools & Manufacture, vol. 44, (no. 7-8), pp. 707-716., 2004. | Journal Article
 
Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Xin, X. J⋅Pei, Z J and Liu, Wenjie
Journal of Electronic Packaging (Transactions of the ASME), vol. 126, (no. 2), pp. 177-185, 2004. | Journal Article
 
Fuzzy adaptive networks in machining process modeling: surface roughness prediction for turning operations
Jiao, Yue⋅Lei, Shuting⋅Pei, Z J and Lee, E. S
International Journal of Machine Tools & Manufacture, vol. 44, (no. 15), pp. 1643-1651, 2004. | Journal Article
 
Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments.
Sun, Xuekun⋅Pei, Z J⋅Xin, X. J and Fouts, Mandy
International Journal of Machine Tools & Manufacture, vol. 44, (no. 1), pp. 11-19., 2004. | Journal Article
2003
Fine grinding of silicon wafers: a mathematical model for grinding marks.
Chidambaram, S.⋅Pei, Z J and Kassir, S.
International Journal of Machine Tools & Manufacture, vol. 43, (no. 15), pp. 1595-1602, 2003. | Journal Article
 
Fine grinding of silicon wafers: a mathematical model for the chuck shape.
Chidambaram, S.⋅Pei, Z J and Kassir, S.
International Journal of Machine Tools & Manufacture, vol. 43, (no. 7), pp. 739-746, 2003. | Journal Article
 
MACHINING CERAMICS WITH ROTARY ULTRASONIC MACHINING
Treadwell, C.⋅WCA and Pei, Z J
Ceram.Ind. Vol. 153, vol. 153, (no. 6), pp. 39-42, 2003. | Journal Article
2002
A study on surface grinding of 300 mm silicon wafers
Pei, Z J
International Journal of Machine Tools and Manufacture, vol. 42, (no. 3), pp. 385-393, 2002. | Journal Article
 
Fine grinding of silicon wafers: designed experiments.
Pei, Z J and Strasbaugh, A.
International Journal of Machine Tools and Manufacture, vol. 42, (no. 3), pp. 395-404, 2002. | Journal Article
 
Modeling of material removal rate in rotary ultrasonic machining: designed experiments
Hu, P.⋅Zhang, J. M⋅Pei, Z J and Treadwell, C.
Journal of Materials Processing Technology (Netherlands), vol. 129, (no. 1-3), pp. 339-344, 2002. | Journal Article
2001
Fine grinding of silicon wafers
Pei, Z J and A., Strasbaugh |
International Journal of Machine Tools & Manufacture (UK), vol. 41, (no. 5), pp. 659-672, 2001. | Journal Article