111 Publications (Page 3 of 5)
2008
Grinding of silicon wafers: A review from historical perspectives
Pei, Z J⋅Fisher, Graham R and Liu, J.
International Journal of Machine Tools & Manufacture, vol. 48, (no. 12-13), pp. 1297-1307, 2008. | Journal Article
 
MECHANICAL DRILLING PROCESSES FOR TITANIUM ALLOYS: A LITERATURE REVIEW
Zhang, P. F⋅Churi, N. J⋅Pei, Z J and Treadwell, C.
Machining Science and Technology, vol. 12, (no. 4), pp. 417-444, 2008. | Journal Article
 
OPTICAL METHODS FOR NONDESTRUCTIVE EVALUATION OF SUBSURFACE FLAWS IN SILICON NITRIDE CERAMICS
Sun, J. G⋅Liu, Z. P⋅Pei, Z J⋅Phillips, N. S and Jensen, J. A
Ceramic Engineering and Science Proceedings, pp. 181-188, 2008. | Journal Article
 
Simultaneous double side grinding of silicon wafers: a mathematical model for the wafer shape
Li, Z. C⋅Pei, Z J and Fisher, Graham R
International Journal of Nanomanufacturing, vol. 2, (no. 6), pp. 556-571, 2008. | Journal Article
 
Simultaneous double side grinding of silicon wafers: a mathematical study on grinding marks
Li, Zhichao⋅Pei, Z J and Fisher, Graham R
International Journal of Abrasive Technology, vol. 1, (no. 3-4), pp. 287-301, 2008. | Journal Article
 
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Wu, Jian⋅Sun, Xuekun⋅Pei, Z J⋅Xin, X. J and Simmelink, Kelli
International Journal of Manufacturing Technology and Management, vol. 13, (no. 2-4), pp. 169-186, 2008. | Journal Article
 
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Wu, Jian (Jessie)⋅Sun, Xuekun⋅Pei, Z J⋅Xin, X. J and Simmelink, Kelli
International Journal of Manufacturing Technology and Management, vol. 13, (no. 2/3/4), 2008. | Journal Article
 
Support Vector Fuzzy Adaptive Network in the Modeling of Material Removal Rate in Rotary Ultrasonic Machining
Shen, Judong⋅Pei, Z J and Lee, E. S
Journal of Manufacturing Science and Engineering (Transactions of the ASME), vol. 130, (no. 4), pp. 041005 (8 pp), 2008. | Journal Article
2007
A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: DECOMPOSITION ANALYSIS OF WAFER SURFACES
Lu, W. K⋅Pei, Z J and Fisher, Graham R
Machining Science and Technology, vol. 11, (no. 1), pp. 81-97, 2007. | Journal Article
 
ELID grinding of silicon wafers: A literature review
Liu, J. H⋅Pei, Z J and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 47, (no. 3-4), pp. 529-536, 2007. | Journal Article
 
Experimental investigations of silicon wafer grinding.
Liu, J. H⋅Pei, Z J and Fisher, Graham R
Key Engineering Materials, vol. 329, pp. 361-366, 2007. | Journal Article
 
EXPERIMENTAL INVESTIGATIONS ON ROTARY ULTRASONIC MACHINING OF HARD-TO-MACHINE MATERIALS
Churi, Nikhil J⋅Pei, Z J and Treadwell, Clyde
Materials Processing Under the Influence of External Fields, pp. 139-144, 2007. | Journal Article
 
Grinding wheels for manufacturing of silicon wafers: A literature review
Liv, J. H⋅Pei, Z J and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 47, (no. 1), pp. 1-13, 2007. | Journal Article
 
Investigations of silicon wafer grinding using finite element analysis
Liu, J H⋅Pei, Z J and Fisher, G R
International Journal of Computer Applications in Technology, vol. 29, (no. 2-4), 2007. | Journal Article
 
Investigations of silicon wafer grinding using finite element analysis
Liu, J. H⋅Pei, Z J and Fisher, G. R
International Journal of Computer Applications in Technology, vol. 29, (no. 2-3-4), pp. 102-107, 2007. | Journal Article
 
Investigations on Edge Chipping in Rotary Ultrasonic Machining Using Finite Element Analysis
Chen, Yu⋅Pei, Z J and Treadwell, Clyde
Materials Science Forum, vol. 532-533, pp. 969-972, 2007. | Journal Article
 
Rotary Ultrasonic Machining of Advanced Ceramics
Zang, Weimin⋅Xu, Xipeng and Pei, Z J
Materials Science Forum, vol. 532-533, pp. 361-364, 2007. | Journal Article
 
Rotary ultrasonic machining of silicon carbide: designed experiments
Churi, Nikhi J⋅Pei, Z J⋅Shorter, Dustin C and Treadwell, Clyde
International Journal of Manufacturing Technology and Management, vol. 12, (no. 1-3), 2007. | Journal Article
 
Rotary ultrasonic machining of titanium alloy (Ti-6Al-4V): effects of tool variables
Churi, N. J⋅Pei, Z J and Treadwell, C.
International Journal of Precision Technology, vol. 1, (no. 1), pp. 85-96, 2007. | Journal Article
2006
A Fuzzy Adaptive Network Model for Waviness Removal in Grinding of Wire-Sawn Silicon Wafers
Jiao, Yue⋅Pei, Z J⋅Lei, Shuting⋅Lee, E. S and Fisher, Graham R
Journal of Manufacturing Science and Engineering (Transactions of the ASME), vol. 128, (no. 4), pp. 938-943, 2006. | Journal Article
 
A grinding-based manufacturing method for silicon wafers: generation mechanisms of central bumps on ground wafers.
Sun, Wangping⋅Pei, Z J and Fisher, Graham R
Machining Science and Technology, vol. 10, (no. 2), pp. 219-233, 2006. | Journal Article
 
A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers
Zhang, X. H⋅Pei, Z J and Fisher, Graham R
International Journal of Machine Tools & Manufacture, vol. 46, (no. 3-4), pp. 397-403, 2006. | Journal Article
 
Edge-chipping reduction in rotary ultrasonic machining of ceramics: Finite element analysis and experimental verification.
Li, Zhichao⋅Cai, Liang Wu⋅Pei, Z J and Treadwell, C.
International Journal of Machine Tools & Manufacture, vol. 46, (no. 12-13), pp. 1469-1477, 2006. | Journal Article
 
EXPERIENCE WITH INTERACTIVE METHODS IN MANUFACTURING COURSES
Zhang, Jiamnei and Pei, Z J
2006 ASEE Annual Conference & Exposition: Excellence in Education; Chicago, IL; USA; 18-21 June 2006. 2006. | Conference Proceeding
 
EXPERIENCE WITH INTERACTIVE METHODS IN MANUFACTURING COURSES
Zhang, Jiamnei and Pei, Z J
2006 ASEE Annual Conference & Exposition: Excellence in Education; Chicago, IL; USA; 18-21 June 2006. 2006. | Conference Proceeding