16 Publications
2010
A New Method of Adaptive Integration with Error Control for Bond-Based Peridynamics
Yu, KebingXin, X. J and Lease, Kevin B
World Congress on Engineering 2012. July 4-6, 2012. London, UK., vol. 2187, pp. 1041-1046, 2010. | Journal Article
2008
Elastoplastic meshless integral method
Ma, JianfengXin, X. J and Krishnaswami, Prakash
Computer Methods in Applied Mechanics and Engineering, vol. 197, (no. 51-52), pp. 4774-4788, 2008. | Journal Article
 
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Wu, Jian (Jessie)Sun, XuekunPei, Z JXin, X. J and Simmelink, Kelli
International Journal of Manufacturing Technology and Management, vol. 13, (no. 2/3/4), 2008. | Journal Article
 
Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Wu, JianSun, XuekunPei, Z JXin, X. J and Simmelink, Kelli
International Journal of Manufacturing Technology and Management, vol. 13, (no. 2-4), pp. 169-186, 2008. | Journal Article
2006
A meshless integral method based on regularized boundary integral equation
Bodin, AnthonyMa, JianfengXin, X. J and Krishnaswami, Prakash
Computer Methods in Applied Mechanics and Engineering, vol. 195, (no. 44-47), pp. 6258-6286, 2006. | Journal Article
2005
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
Sun, X. KXin, X. J and Pei, Z J
Journal of Electronic Packaging (Transactions of the ASME), vol. 127, (no. 2), pp. 189-192, 2005. | Journal Article
2004
Finite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Xin, X. JPei, Z J and Liu, Wenjie
Journal of Electronic Packaging (Transactions of the ASME), vol. 126, (no. 2), pp. 177-185, 2004. | Journal Article
 
Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments.
Sun, XuekunPei, Z JXin, X. J and Fouts, Mandy
International Journal of Machine Tools & Manufacture, vol. 44, (no. 1), pp. 11-19., 2004. | Journal Article
2003
Investigation of yield surface of monolithic and composite powders by explicit finite element simulation
Xin, X. JJayaraman, P.Daehn, Glenn S and Wagoner, Robert H
International Journal of Mechanical Sciences, vol. 45, (no. 4), pp. 707-723, 2003. | Journal Article
2002
Explicit finite element method simulation of consolidation of monolithic and composite powders
Xin, X. JJayaraman, P.Jiang, G.Wagoner, R. H and Daehn, Glenn S
Metallurgical and Materials Transactions A. Physical Metallurgy and Materials Science, vol. 33A, (no. 8), pp. 2649-2658, 2002. | Journal Article
 
Explicit finite element method simulation of consolidation of monolithic and composite powders
Xin, X. JJayaraman, P.Jiang, G.Wagoner, R. H and Daehn, Glenn S
Metallurgical and Materials Transactions, vol. 33A, (no. 8), pp. 2649-2658, Aug 2002. | Journal Article
 
Explicit finite element method simulation of consolidation of monolithic and composite powders
Xin, X. JJayaraman, P.Jiang, G.Wagoner, R. H and Daehn, Glenn S
Metallurgical and Materials Transactions A (USA), vol. 33A, (no. 8), pp. 2649-2658A, 2002. | Journal Article
1999
A general numerical method to solve for dislocation configurations
Xin, X. JWagoner, Robert H and Daehn, Glenn S
Metallurgical and Materials Transactions A (USA), vol. 30A, (no. 8), pp. 2073-2087, 1999. | Journal Article
1998
Finite segment method for dislocation mechanics
Xin, X. JWagoner, Robert H and Daehn, Glenn S
Scripta Materialia (USA), vol. 39, (no. 4-5), pp. 397-407, 1998. | Journal Article
1997
Equilibrium configuration of coaxial prismatic dislocation loops and related size-dependent plasticity
Xin, X. JDaehn, Glenn S and Wagoner, Robert H
Acta Materialia (USA), vol. 45, (no. 5), pp. 1821-1836, 1997. | Journal Article
n.d.no date or unknown
Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment.
Pei, Z JXin, X. J and Liu, W.
International Journal of Machine Tools & Manufacture, vol. 43, (no. 1), pp. 7-16.. | Journal Article