40 Publications (Page 1 of 2)
2009
Flexible Electronics: Thin Silicon Die on Flexible Substrates
Zhang, Tan⋅Hou, Zhenwei⋅Johnson, Wayne⋅del Castillo, L.⋅Moussessian, A.⋅Greenwell, R. and Blalock, BJ
IEEE Transactions on Electronics Packaging Manufacturing, vol. 32, (no. 4), pp. 291-300, 2009. | Journal Article
2008
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
Banda, C.⋅Johnson, Wayne⋅Zhang, Tan⋅Hou, Zhenwei and Charles, HK
IEEE Transactions on Electronics Packaging Manufacturing, vol. 31, (no. 1), pp. 1-8, 2008. | Journal Article
2007
Investigation of the Role of Void Formation at the Cu-to-Intermetallic Interface on Aged Drop Test Performance
Liu, Yueli⋅Gale, S. and Johnson, Wayne
IEEE Transactions on Electronics Packaging Manufacturing, vol. 30, (no. 1), pp. 63-73, 2007. | Journal Article
 
Optimization of lead free solder 01005 component assembly
Liu, Yueli and Johnson, Wayne
Soldering & Surface Mount Technology, vol. 19, (no. 1), pp. 15-27, 2007. | Journal Article
 
Power Device Packaging Technologies for Extreme Environments
Johnson, Wayne⋅Wang, Cai⋅Liu, Yi and Scofield, JD
IEEE Transactions on Electronics Packaging Manufacturing, vol. 30, (no. 3), pp. 182-193, 2007. | Journal Article
2006
Lead-free chip scale packages: assembly and drop test reliability
Liu, Yueli⋅Tian, Guoyun⋅Gale, S.⋅Johnson, Wayne and Crane, L.
IEEE Transactions on Electronics Packaging Manufacturing, vol. 29, (no. 1), pp. 1-9, 2006. | Journal Article
2005
Corner bonding of CSPs: processing and reliability
Tian, Guoyun⋅Liu, Yueli⋅Johnson, Wayne⋅Lall, Pradeep⋅Palmer, M.⋅Islam, M. N and Crane, L.
IEEE Transactions on Electronics Packaging Manufacturing, vol. 28, (no. 3), pp. 231-240, 2005. | Journal Article
 
SiC Power Device Packaging Technologies for 300 to 350 DGC Applications
Johnson, Wayne and Williams, John
Materials Science Forum, vol. 483-485, pp. 785-790, 2005. | Journal Article
2004
Thermal cycling reliability of lead-free chip resistor solder joints
Suhling, Jeffrey C⋅Gale, H. S⋅Johnson, Wayne⋅Islam, M. N⋅Shete, Tushar⋅Lall, Pradeep⋅Bozack, Michael J⋅Evans, John L⋅Seto, Ping⋅Gupta, Tarun and Thompson, James R
Soldering & Surface Mount Technology, vol. 16, (no. 2), pp. 77-87, 2004. | Journal Article
2003
Processing of fluxing underfills for flip chip-on-laminate assembly
Zhao, R.⋅Johnson, Wayne⋅Jones, G.⋅Yaeger, E.⋅Konarski, M.⋅Krug, P. and Crane, L. L
IEEE Transactions on Electronics Packaging Manufacturing, vol. 26, (no. 1), pp. 75-83, 2003. | Journal Article
2002
A computational study on solder bump geometry, normal, restoring, and fillet forces during solder reflow in the presence of liquefied underfill
Zhang, Yun⋅Zhao, Renzhe⋅Harris, Daniel K and Johnson, Wayne
IEEE Transactions on Electronics Packaging Manufacturing, vol. 25, (no. 4), pp. 308-317, 2002. | Journal Article
 
High-temperature storage and thermal cycling studies of thick film and wirewound resistors
Naefe, J. E⋅Johnson, Wayne and Grzybowski, R. R
IEEE Transactions on Components and Packaging Technologies, vol. 25, (no. 1), pp. 45-52, 2002. | Journal Article
 
Wetting characteristics of Pb-free solder alloys and PWB finishes
Sattiraju, S. V⋅Dang, Bing⋅Johnson, Wayne⋅Li, Yali⋅Smith, J. S and Bozack, M. J
IEEE Transactions on Electronics Packaging Manufacturing, vol. 25, (no. 3), pp. 168-184, 2002. | Journal Article
2001
Lead-free solder flip chip-on-laminate assembly and reliability
Hou, Zhenwei⋅Tian, Guoyun⋅Hatcher, C.⋅Johnson, Wayne⋅Yaeger, E. K⋅Konarski, M. M and Crane, L.
IEEE Transactions on Electronics Packaging Manufacturing, vol. 24, (no. 4), pp. 282-292, 2001. | Journal Article
1999
Development of reworkable underfills, materials, reliability and processing
Chane, L.⋅Torres-Filho, A.⋅Ober, Christopher K⋅Yang, Shu⋅Chen, Jir-Shyr and Johnson, Wayne
IEEE Transactions on Components and Packaging Technologies, vol. 22, (no. 2), pp. 163-167, 1999. | Journal Article
 
In-situ stress state measurements during chip-on-board assembly
Zou, Y.⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅Jaeger, Richard C and Mian, Ahsan
IEEE Transactions on Electronics Packaging Manufacturing, vol. 22, (no. 1), pp. 38-52, 1999. | Journal Article
 
International conference on multichip modules and high density packaging
Johnson, Wayne
IEEE Transactions on Advanced Packaging, vol. 22, (no. 3), pp. 365-365, 1999. | Journal Article
 
Thermal cycle reliability of solder joints to alternate plating finishes
Johnson, Wayne⋅Wang, Vicky and Palmer, Michael
Circuit World, vol. 25, (no. 2), pp. 27-30, 1999. | Journal Article
1997
Measurement of die stress in advanced electronic packaging for space and terrestrial applications
Suhling, Jeffrey C⋅Lin, S. T⋅Moral, R. J⋅Johnson, Wayne and Jaeger, Richard C
Space Technology & Applications International Forum - Conference on Applications of Thermophysics in Microgravity, 1st and Conference on Commercial Development of Space, 2nd, Albuquerque, NM; UNITED STATES; 26-30 Jan. 1997. 1997. | Conference Proceeding
1996
Thermo-mechanical analysis of metal backed circuit boards
Johnson, Wayne⋅Knight, Roy W and Suhling, Jeffrey C
Space Technology and Applications International Forum (STAIF-96); Proceedings of the 1st Conference on Commercial Development of Space, Albuquerque, NM; UNITED STATES; 7-11 Jan. 1996. 1996. | Conference Proceeding
1995
Consortium for automotive electronics - An approach to MCM technology development
Johnson, Wayne⋅Knadler, Marnie⋅Petrovic, George⋅Parker, Chauvet⋅Desai, Jay⋅Bosley, Larry⋅Witty, Mike and Prodromides, Kevin
Multichip modules; Proceedings of the 4th International Conference and Exhibition on Multichip Modules (ICEMCM '95), Denver, CO; UNITED STATES; 19-21 Apr. 1995. 1995. | Conference Proceeding
 
Fabrication procedures and characterization of 6H-SiC MESFETs for use in high temperature electronics
Casady, J. B⋅Luckowski, E. D⋅Johnson, Wayne⋅Crofton, John and Williams, J. R
PROC ELECTRON COMPON TECHNOL CONF, pp. 261-265, 1995. | Journal Article
 
Low frequency noise in 6H-SiC MOSFET's
Casady, J. B⋅Dillard, W.⋅Johnson, Wayne⋅Agarwal, A. K⋅Siergiej, R. R and Wagner, W. E
IEEE Electron Device Letters, vol. 16, (no. 6), pp. 274-276, 1995. | Journal Article
 
MCM packaging alternatives for automotive electronics - Comparing fine pitch, ball grid array, and polyimide chip carriers
Evans, John L⋅Bosley, Larry E⋅Romanczuk, Chris S and Johnson, Wayne
Multichip modules; Proceedings of the 4th International Conference and Exhibition on Multichip Modules (ICEMCM '95), Denver, CO; UNITED STATES; 19-21 Apr. 1995. 1995. | Conference Proceeding
1994
Reliability of plastic quad flat pack solder joints in potted automotive engine controllers
White, J. D⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅Knight, R. W and Romanczuk, C. S
International Symposium on Microelectronics, 27th, Boston, MA; UNITED STATES; 15-17 Nov. 1994. 1994. | Conference Proceeding