System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates
Evans, John L⋅Lall, P.⋅Knight, R.⋅Crain, E.⋅Shete, T. and Thompson, J. R
IEEE Transactions on Components and Packaging Technologies, vol. 31, (no. 1), pp. 74-85, 2008. | Journal Article