40 Publications (Page 2 of 2)
1994
Reliability of plastic quad flat pack solder joints in potted automotive engine controllers
WHITE, J. D⋅Suhling, Jeffrey C⋅Johnson, Wayne⋅KNIGHT, R. W and ROMANCZUK, C. S
Proceedings, 27th International Symposium on Microelectronics, Boston, MA; 15-17 Nov. 1994. 1994. | Conference Proceeding
 
Solder joint reliability of surface mount chip resistors / capacitors on insulated metal substrates
Suhling, Jeffrey C⋅Johnson, Wayne⋅WHITE, J. D⋅MATTHAI, K. W and KNIGHT, R. W
Proceedings, 44th Electronic Components and Technology Conference, Washington DC; 1-4 May 1994. 1994. | Conference Proceeding
1993
200 C operation of semiconductor power devices
Bromstead, James R⋅Weir, G. B and Johnson, Wayne
Space nuclear power and propulsion; Proceedings of the 10th Symposium, Albuquerque, NM; UNITED STATES; 10-14 Jan. 1993. 1993. | Conference Proceeding
 
Piezoresistive sensor chip for measurement of stress in electronic packaging.
Jaeger, Richard C⋅Suhling, Jeffrey C⋅Carey, Martin T and Johnson, Wayne
1993 Proceedings of the 43rd Electronic Components and Technology Conference; Orlando, FL; USA; 01-04 June 1993. 1993. | Conference Proceeding
1992
Characterization of polycrystalline diamond thin films grown on various substrates
Ramesham, R.⋅Roppel, T. and Johnson, Wayne
Thin Solid Films, vol. 212, (no. 1-2), pp. 93-103, 1992. | Journal Article
1991
Insulated metal substrates for the fabrication of a half-bridge power hybrid
Johnson, Wayne⋅THOMAS, E. L⋅DUREN, R. M⋅CURINGTON, D. W and LIPPINCOTT, A. C
IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 14, (no. 4), pp. 886-893, 1991. | Journal Article
 
Piezoresistive sensors for measurement of thermally-induced stresses in microelectronics
Suhling, Jeffrey C⋅BEATY, R. E⋅Jaeger, Richard C and Johnson, Wayne
1991 SEM Spring Conference on Experimental Mechanics, Milwaukee, WI; UNITED STATES; 10-13 June 1991. 1991. | Conference Proceeding
1990
A novel RF-insensitive EED utilizing a balanced reactive bridge
Baginski, T. A and Johnson, Wayne
IEEE Transactions on Electromagnetic Compatibility, vol. 32, (no. 1), pp. 69-73, 1990. | Journal Article
 
Benzocyclobutene interlayer dielectrics for thin film multichip modules.
Johnson, Wayne⋅Phillips, T. L⋅Weidner, W. K⋅Hahn, S. F⋅Burdeaux, D. C and Townsend, P. H
IEEE TRANS. COMPONENTS HYBRIDS MANUF. TECHNOL., vol. 13, (no. 2), pp. 347-352, 1990. | Journal Article
 
Full wave three-dimensional simulation of Maxwell's equations for the electrical characterization of high-speed interconnects.
German, F. J and Johnson, Wayne
IEEE TRANS. COMPONENTS HYBRIDS MANUF. TECHNOL., vol. 13, (no. 2), pp. 341-346, 1990. | Journal Article
1989
Multichip thin-film technology on silicon.
Johnson, Wayne⋅Phillips, T. L⋅Jaeger, Richard C⋅Hahn, S. F and Burdeaux, D. C
IEEE TRANS. COMPONENTS HYBRIDS MANUF. TECHNOL., vol. 12, (no. 2), pp. 185-194, 1989. | Journal Article
 
Plated copper on ceramic for power hybrid applications
WEEKS, R.⋅C.P.Wong, D.H.Loescher a⋅Johnson, Wayne⋅Hopkins, Douglas C⋅MUIR, J. and WILLIAMS, J. R
Electronic Components, Proceedings, 39th Conference, Houston, TX; 22-24 May 1989. 1989. | Conference Proceeding
 
Plated Copper on Ceramic Substrates For Power Hybrid Circuits
Johnson, Wayne⋅Weeks, R.⋅Hopkins, Douglas C⋅Muir, J. and Williams, J. R
IEEE Trans Compon Hybrid Mfg Tech, vol. 12, (no. 4), pp. 530-536, 1989. | Journal Article
1981
ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORS
PITT, V. A⋅NEEDES, C. R and Johnson, Wayne
INSUL CIRCUITS, vol. 27, (no. 11), pp. 51-55, 1981. | Journal Article
1980
Thermosonic gold wire bonding to silver bearing conductors
Johnson, Wayne and COTE, R. E
ISHM 80, Proceedings, International Microelectronics Symposium, New York; 20-22 Oct. 1980. 1980. | Conference Proceeding