52 Publications (Page 2 of 3)
2008
Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies
Lall, Pradeep⋅Choudhary, P.⋅Gupte, S. and Suhling, JC
IEEE Transactions on Components and Packaging Technologies, vol. 31, (no. 1), pp. 173-183, 2008. | Journal Article
 
Nano-Underfills for High-Reliability Applications in Extreme Environments
Lall, Pradeep⋅Islam, S.⋅Guoyun Tian, Guoyun T and Suhling, JC
IEEE Transactions on Components and Packaging Technologies, vol. 31, (no. 1), pp. 114-125, 2008. | Journal Article
2007
Feature extraction and damage-precursors for prognostication of lead-free electronics
Lall, Pradeep⋅Hande, Madhura⋅Bhat, Chandan⋅Islam, Nokibul⋅Suhling, Jeff and Lee, Jay
Microelectronics Reliability, vol. 47, (no. 12), pp. 1920, 2007. | Journal Article
 
In-Situ, Real-Time Detector for Faults in Solder Joint Networks of Operational, Fully-Programmed Field Programmable Gate Arrays (FPGAs)
Hofmeister, James P⋅Lall, Pradeep and Graves, Russell
IEEE Instrumentation & Measurement Magazine, vol. 10, (no. 4), pp. 37, 2007-August. | Journal Article
 
Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
Lall, Pradeep⋅Lall, Pradeep⋅Islam, Nokibul⋅Islam, Nokibul⋅Evans, John L⋅Evans, John⋅Suhling, Jeff and Suhling, Jeff
Journal of Electronic Packaging, vol. 129, (no. 4), pp. 390, 2007-12-01. | Journal Article
 
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
Lall, Pradeep⋅Panchagade, Dhananjay⋅Liu, Yueli⋅Johnson, Wayne and Suhling, Jeff
Journal of Electronic Packaging (Transactions of the ASME), vol. 129, (no. 4), pp. 373-381, 2007. | Journal Article
2006
Prognostics and Health Management of Electronic Packaging
Lall, Pradeep⋅Islam, MN⋅Rahim, MK and Suhling, Jeffrey C
IEEE Transactions on Components and Packaging Technologies, vol. 29, (no. 3), 2006. | Journal Article
2005
Corner bonding of CSPs: processing and reliability
Tian, Guoyun⋅Liu, Yueli⋅Johnson, Wayne⋅Lall, Pradeep⋅Palmer, M.⋅Islam, M. N and Crane, L.
IEEE Transactions on Electronics Packaging Manufacturing, vol. 28, (no. 3), pp. 231-240, 2005. | Journal Article
 
Die stress characterization in flip chip on laminate assemblies
Rahim, M. K⋅Suhling, Jeffrey C⋅Copeland, D. S⋅Islam, M. S⋅Jaeger, Richard C⋅Lall, Pradeep and Johnson, R. W
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 415-429, 2005. | Journal Article
 
Measurement of the temperature dependent constitutive behavior of underfill encapsulants
Islam, M. S⋅Suhling, Jeffrey C and Lall, Pradeep
IEEE Transactions on Components and Packaging Technologies, vol. 28, (no. 3), pp. 467-476, 2005. | Journal Article
2004
Thermal cycling reliability of lead-free chip resistor solder joints
Suhling, Jeffrey C⋅Gale, H. S⋅Johnson, Wayne⋅Islam, M. N⋅Shete, Tushar⋅Lall, Pradeep⋅Bozack, Michael J⋅Evans, John L⋅Seto, Ping⋅Gupta, Tarun and Thompson, James R
Soldering & Surface Mount Technology, vol. 16, (no. 2), pp. 77-87, 2004. | Journal Article
2003
Corner Bonding of CSPs : Processing and Reliability
Tian, G., Liu, Y., Lall, P., Johnson, W., Suhling, J. and Lall, Pradeep
March 2003
 
Drop Reliability of Corner Bonded CSP in Portable Products
G. Tian, Y. Liu, P. Lall, W. Johnson, S. Abderrahman, M. Palmer, N. Islam, J. Suhling and Lall, Pradeep
July 2003
 
Experimental Measurements of the Mechanical Properties of Underfill Encapsulants
Islam, S., Suhling, J., Lall, P. and Lall, Pradeep
May 2003
 
Finite Element Parametric Analysis On Fine-Pitch BGA (FBGA) Packages
Chong, D., Wang, C. K., Fong, K. C., Lall, P. and Lall, Pradeep
July 2003
 
Measurement of Stress and Delamination in Flip Chip on Laminate Assemblies
Rahim, K., Suhling, J., Copeland, D. S., Jaeger, R., Lall, P. and Lall, Pradeep
July 2003
 
Measurement Of The Constitutive Behavior of Underfill Encapsulants
Islam, S., Suhling, J., Lall, P. and Lall, Pradeep
July 2003
 
Measurement Of Underfill To Soldermask Adhesion Strength
Islam, S., Suhling, J., Johnson, W., Lall, P. and Lall, Pradeep
June 2003
 
Model for BGA and CSP in Automotive Underhood Environments
Lall, P., Islam, N, Suhling, J., Darveaux, R. and Lall, Pradeep
May 2003
2000
1. Assembly-Level Reliability of Flex-Substrate BGA, Elastomer-on-Flex Packages, and 0.5 mm Pitch Partial Array Packages
Lall, P., Banerji, K. and Lall, Pradeep
(pp. 1081-1095). 2000
 
Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages
Lall, Pradeep and Banerji, Kingshuk
Microelectronics and Reliability, vol. 40, (no. 7), pp. 1081-1095, 2000. | Journal Article
1999
Semiconductor Devices: Chip-Scale Packaging
Lall, Pradeep
1999
1997
Estimating the Influence of Temperature on Microelectronic Reliability, CRC Press
P. Lall, Pecht, M., Hakim and Lall, Pradeep
1997
1996
Temperature as an input to microelectronics - reliability models
Lall, Pradeep
IEEE Transactions on Reliability, vol. 45, (no. 1), pp. 3, 19960301. | Journal Article
1993
Influence of temperature on microelectronic device failures (Dissertation)
Lall, Pradeep (1993).